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Accurus Solder Ball 1 (ลูกบอลตะกั่ว)

Lead-Free Solder Ball


Lead-Free Solder Ball


Product Feature

Manufactured from alloy and BGA Solder Ball, and R & D per customer needs.

self-developed patent production equipment, can produce 0.889mm ~ 0.035mm high quality BGA solder ball, suitable for semiconductor and related industries for packaging.

Packaging material using anti-static material, static electricity can be attached to avoid the bottle, resulting in the use of distress.

original patents were obtained, can be safe to use, no infringement concerns.